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TriQuint is proud to announce the latest additions to our innovative RF portfolio. View our New Products page to discover ways to simplify your RF designs across mobile, network infrastructure and defense applications.
TriQuint's LowDrift™ and NoDrift™ filter technologies dramatically reduce temperature sensitivity for fewer dropped calls and a better user experience.
TriQuint's QUANTUM Tx™ family of highly integrated transmit modules reduce board space and enable a much smaller footprint for 2G / 3G / 4G mobile devices. Find out how these building blocks can make RF design easier and faster for 2G and entry-level 3G devices.
Patented Spatium™ technology from TriQuint delivers a higher standard of efficiency, reliability and frequency range for high-power RF applications including communications, electronic warfare (EW), radar and test and measurement.
TriQuint's innovative TriAccess™ portfolio enables more efficient broadband video, voice and data services. TriQuint amplifiers and filters lower power consumption with improved performance. TriQuint enables all major 75 ohm RF systems in headend, infrastructure, MDU and CPE applications.
Consumers have come to expect Wi-Fi connectivity in their smartphones, tablets and other mobile devices. You'll find TriQuint's TriConnect® Wi-Fi RF modules in many of the world's most sought-after products.
TRITIUM™ is a family of highly integrated modules designed for use in 3G mobile phones, data cards and USB modems. Optimize your 3G CDMA / WCDMA / HSUPA applications and gain maximum design flexibility.
TriQuint's highly integrated TRIUMF™ MMPAs are one more proven way that TriQuint engineers are delivering innovative solutions for the most complex mobile design challenges for cutting-edge smartphones. Let us help you simplify your 2G / 3G / 4G design and enhance system performance while speeding time to market.
Part # TGA1073B-SCC
The TriQuint TGA1073B-SCC is a three stage HPA MMIC design using TriQuint's proven 0.25 um Power pHEMT process. The TGA1073B-SCC is designed to support a variety of millimeter wave applications including point-to-point digital radio and LMDS/LMCS and Ka band satellite ground terminals.
The three stage design consists of a 2 x 300 um input stage driving a 2 x 600 um interstage followed by a 4 x 600 um output stage. The TGA1073B-SCC provides 28.5 dBm nominal output power at 1dB compression across 27 - 32 GHz. Typical small signal gain is 25 dB at 28 GHz and 18 dB at 32 GHz.
The TGA1073B-SCC requires minimum off-chip components. Each device is 100% DC and RF tested on-wafer to ensure performance compliance. The device is available in chip form.